关键词: 单机调度, 晶圆清洗, 柔性维护, 释放时间, 启发式算法

Abstract: Aiming at the joint optimization problem of production scheduling considering cleaning and maintenance in wafer manufacturing process,to minimizing the objective of maximum completion time,the processing sequence of workpiece and the execution time of maintenance activities were optimized.The problem was proved to be NP hard,and an integer programming model was established and linearized.Combined with the characteristics of batch scheduling problem under the constraint of machine service age,the solution properties were proved,and the heuristic algorithm named Earliest Release Date—Longest Processing Time—Best Fit Longest Dirt (ERD-LTT-BFLD) was designed to solve the problem.A lower bound algorithm considering the release time and cleaning activity constraints was constructed.To verify the effectiveness of the proposed algorithm for different scale instances,the performance of the proposed heuristic algorithm was compared with the results from CPLEX and the lower bound algorithm in simulation experiments.

Key words: single-machine scheduling, wafer cleaning, flexible maintenance, release time, heuristic algorithms