• 论文 •    

低压力铜化学机械抛光集散控制系统

门延武,张辉,周凯,叶佩青   

  1. 清华大学 摩擦学国家重点实验室,北京100084
  • 出版日期:2010-12-15 发布日期:2010-12-25

Low downforce copper chemical mechanical polishing distributed control system

MEN Yan-wu, ZHANG Hui, ZHOU Kai, YE Pei-qing   

  1. State Key Laboratory of Tribology, Tsinghua University, Beijing 100084, China
  • Online:2010-12-15 Published:2010-12-25

摘要: 针对化学机械抛光设备提出了PC+NC+实时网络分布式可编程自动控制器的控制方案,并介绍了该系统的总体结构和主控制系统、网络化协调控制子系统、分布式执行控制子系统等核心环节的软硬件实现技术。单区域抛光头气压控制结果表明,该系统具有较高的稳定性和可靠性,能很好地满足化学机械抛光项目的总体要求。

关键词: 化学机械抛光, 运动控制, 网络化递阶系统, 分布式执行, 可编程自动控制器

Abstract: To tackle such complicated system of Chemical Mechanical Polishing(CMP), PC+ NC+ distributed real-time network Programmable Automation Controller (PAC) system was proposed. Overall architecture of CMP system, software and hardware technology of main control system, subsystem for networked coordinated control and subsystem for implementing distributed control were discussed in detail. Single-zone pressure control scheme of polishing head was further studied. Experiment results showed that the established control system had high stability and reliability. It could satisfy the requirements of CMP projects.

Key words: chemical mechanical polishing, motion control, network rank system, distributed implement, programmable automation controllers

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